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MEMS Engineering & Material, Inc. provides the following
wafer foundry services to semiconductor and MEMS industry form single process
to proto-type product.
1. Thin Film Coating
Metal(Au,Cr,Al,Cu,Ni,Pt) thin film, SiO2, SiN by
sputtering, evaporation, and CVD.
2. Photolithography
Process
Resist coating, contact & step expose, develop.
Lift off process.
3. Electroplating and
Electroless Plating
Cu, Ni, Au, Solder for interconnect and wafer
bumping.
4. Etching
Wet and dry etching.
5. Wafer Bonding
Fusion, anodic, eutectic, polyimide, polymer bonding.
6. Dicing
Silicon, glass.
7. Grinding and Polishing
Silicon wafer grinding and CMP polishing.
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